Open AccessCard‐Edge Connector Reliability
Author(s) -
Poul Villien
Publication year - 1983
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.11.159
Subject(s) - reliability (semiconductor) , enhanced data rates for gsm evolution , cable gland , computer science , reliability engineering , engineering , telecommunications , physics , power (physics) , quantum mechanics
This paper considers the results of using tin or T/A platings as a substitute for gold in card-edge connectors. Measurements have been made on mated systems before and after various environmental tests. It has been shown that gold-gold contacts still provide the best reliability even if some of the gold platings have become worn through due to constant withdrawal and insertion.
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