Open AccessBioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion
Author(s) -
Lei Wu,
Zhichao Dong,
Huifeng Du,
C. Li,
Nicholas X. Fang,
Yajing Song
Publication year - 2018
Publication title -
research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.8
H-Index - 16
ISSN - 2639-5274
DOI - 10.1155/2018/4795604
Subject(s) - adhesive , curing (chemistry) , materials science , composite material , surface energy , adhesion , low energy , layer (electronics) , physics , atomic physics
Additive manufacturing based on liquid resin curing is one of the most promising methods to construct delicate structures. However, precision and speed are limited by the vertical adhesion of in situ cured resin at the curing interface. To overcome the unavoidable adhesion and to develop a general curing interface, we propose a slippery surface taking inspiration of the peristome surface of the pitcher plant. Such surface shows ultra-low adhesive energy at the curing interface due to the inhibition of the direct contact between the cured resin and the solid surface, which also increases the refilling speed of liquid resin. This ultra-low adhesive energy interface is effective for continuous 3D printing and provides insights into the physical mechanisms in reducing vertical solid-solid interfacial adhesion.