Open AccessFormation of Ohmic Contacts to n-GaAs at Temperatures Compatible with Indium Flip-Chip Bonding
Author(s) -
Michael G. Wood,
C.P. Hains,
Patrick Sean Finnegan,
Chad A. Stephenson,
John F. Klem,
Quinn Looker
Publication year - 2019
Publication title -
meeting abstracts/meeting abstracts (electrochemical society. cd-rom)
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2019-02/13/881
Subject(s) - ohmic contact , flip chip , materials science , indium , annealing (glass) , optoelectronics , melting point , contact resistance , nanotechnology , composite material , layer (electronics) , adhesive
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