Open AccessVoid Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Author(s) -
Fuya Nagano,
Serena Iacovo,
Alain Phommahaxay,
Fumihiro Inoue,
François Chancerel,
H. Naser,
Gerald Beyer,
Eric Beyne,
Stefan De Gendt
Publication year - 2022
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac7662
Subject(s) - void (composites) , wafer , materials science , wafer bonding , anodic bonding , direct bonding , outgassing , composite material , the void , nanotechnology , chemistry , philosophy , organic chemistry , epistemology
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