Open AccessEffect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning
Author(s) -
Samrina Sahir,
Hwi-Won Cho,
Palwasha Jalalzai,
Jerome Peter,
Randeep Singh,
Satomi HAMADA,
Tae-Gon Kim,
Jin–Goo Park
Publication year - 2022
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac6979
Subject(s) - data scrubbing , brush , contamination , materials science , chemical mechanical planarization , layer (electronics) , polyvinyl alcohol , wet cleaning , composite material , wafer , chemical engineering , nanotechnology , waste management , chemistry , organic chemistry , ecology , engineering , biology
The use of polyvinyl acetal (PVA) brushes is one of the most effective and prominent techniques applied for the removal of chemical mechanical planarization (CMP) contaminants. However, the brush can be a source of defects by entrapping the abrasives inside its porous structure during brush scrubbing. In this study, the effect of brush top skin layer was extensively studied on contamination, cross-contamination, and cleaning performance by comparing brushes with and without skin layer. The presence of a dense top skin layer resulted in larger contact areas and high ceria particle adsorption on the skin layer. This leads to higher cross-contamination of the wafers during scrubbing along with high cleaning performances. Conversely, the brushes without skin layer showed lower contamination and negligible cross-contamination with a reduced cleaning performance (removal of ceria particles from oxide surface). Therefore, the role of the brush skin layer is significant and needs to be considered while designing a post-CMP cleaning process.