Open AccessPerspective—Demystifying the Power Withstanding Capabilities of CNT Bundle Interconnects
Author(s) -
Femi Robert,
P. Uma Sathyakam
Publication year - 2022
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac63e3
Subject(s) - bundle , materials science , interconnection , square (algebra) , figure of merit , very large scale integration , power (physics) , power consumption , engineering physics , optoelectronics , electrical engineering , composite material , computer science , telecommunications , engineering , physics , geometry , mathematics , quantum mechanics
This article discusses the power consumption trends of two geometries of CNT bundle interconnects for VLSI applications. The electrostatic and electro-thermal field simulations of square and triangular CNT bundle interconnects are done. Two factors viz. power dissipated and peak temperature are extracted and a new figure of merit called power temperature product (PTP) is defined. The PTP is calculated for interconnect lengths ranging from 500 μ m to 2000 μ m. Results show that both triangular as well as square CNT bundles have high power withstanding capacity. Triangular CNT bundles have higher PTP when the associate phase changes are ignored.