Open AccessEffect of Particle Size and pH Value of Slurry on Chemical Mechanical Polishing of SiO2 Film
Author(s) -
Fan Xu,
WeiLei Wang,
Aoxue Xu,
Daohuan Feng,
Weili Liu,
Song Zhang
Publication year - 2022
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac495f
Subject(s) - chemical mechanical planarization , slurry , polishing , particle size , materials science , zeta potential , surface roughness , particle (ecology) , mechanical strength , chemical engineering , composite material , particle size distribution , surface finish , nanotechnology , nanoparticle , oceanography , geology , engineering
This study investigated the effects of particle size and pH of SiO 2 -based slurry on chemical mechanical polishing for SiO 2 film. It was found that the removal rates and surface roughness of the material was highly dependent on the particle size and pH. As the particle size varied, the main polishing mechanism reasoned to provide activation energy to mechanical erasure. In addition, pH affected the particle size and Zeta potential, which had an important effect on the strength of the mechanical and chemical action of the chemical mechanical polishing. The change in mechanical action greatly influenced the removal rate. According to the experimental results, the best polishing of SiO 2 film was achieved with 40 nm particle size SiO 2 abrasives when the pH was 4.