Open AccessImpact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System
Author(s) -
Gurijala Deepthi,
Girish Kumar Mekala,
Madhavi Tatineni
Publication year - 2021
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac31cd
Subject(s) - materials science , electromigration , interconnection , reliability (semiconductor) , deformation (meteorology) , stress (linguistics) , thermal , through silicon via , optoelectronics , current density , three dimensional integrated circuit , integrated circuit , engineering physics , composite material , silicon , computer science , engineering , computer network , power (physics) , linguistics , physics , philosophy , quantum mechanics , meteorology
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