Open AccessTransient Analysis of Crosstalk Noise Effects in SWCNT Bundle On-Chip Interconnects Using MRTD Technique
Author(s) -
Bhaskar Gugulothu,
Rajendra Naik Bhukya
Publication year - 2021
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac2e7e
Subject(s) - spice , finite difference time domain method , materials science , bundle , electronic engineering , cmos , interconnection , carbon nanotube , time domain , chip , transient (computer programming) , signal integrity , computer science , optoelectronics , nanotechnology , engineering , physics , telecommunications , optics , composite material , computer vision , operating system