Open AccessStorage Temperature Effects on the Slurry Health Parameters and SiO2 Removal Rates during Chemical Mechanical Polishing
Author(s) -
Jihoon Seo,
Ali Othman,
Hong Jin Kim,
Jainendra Devabhaktuni,
Rahul Trivedi,
Dinesh Penigalapati,
Thayalan Kulasingam,
S. S. R. K. Hanup Vegi,
S. V. Babu
Publication year - 2021
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/ac2c56
Subject(s) - materials science , slurry , polishing , chemical mechanical planarization , metallurgy , composite material
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