Open AccessNew Inexpensive Simple Experimental Setup for Anodic Bonding of Silicon-Glass
Author(s) -
Sreeram Sundaresh,
Mamatha G. Deshpande,
Kalpathy B. Sundaram
Publication year - 2021
Publication title -
ecs journal of solid state science and technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.488
H-Index - 51
eISSN - 2162-8777
pISSN - 2162-8769
DOI - 10.1149/2162-8777/abfb0e
Subject(s) - anodic bonding , materials science , anode , silicon , ultimate tensile strength , composite material , bond strength , bonding strength , tensile testing , voltage , metallurgy , electrical engineering , adhesive , layer (electronics) , electrode , chemistry , engineering
A new reliable, simple, inexpensive experimental setup was built to bond silicon (Si)-glass by anodic bonding under atmospheric conditions. Anodic bonding of silicon-glass samples was carried out using a custom in-house-built inexpensive setup. The bonding tensile strength test confirmed that anodic bonding strongly depends on both the bonding temperature and the bonding voltage. The bonding tensile strength was found to be 1134 × 10 4 Nm −2 at a temperature of 420 °C and an applied voltage of 800 V. It has also been concluded from this study that to achieve reasonable bond-tensile strength, the typical temperature and voltage to bond Si-Glass is 385 °C and 700 V, respectively.