Open AccessPlanar SOFC Stack with Low-Cost Multi-Layer Ceramic Interconnect
Author(s) -
Zhien Liu
Publication year - 2005
Publication title -
ecs proceedings volumes
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2576-1579
pISSN - 0161-6374
DOI - 10.1149/200507.0157pv
Subject(s) - interconnection , stack (abstract data type) , materials science , electrical conductor , ceramic , planar , optoelectronics , layer (electronics) , conductor , electronic engineering , computer science , composite material , engineering , telecommunications , computer graphics (images) , programming language
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