Open AccessOptimization of the Copper Plating Process Using the Taguchi Experimental Design Method
Author(s) -
Chia-Fu Hsu,
WeiPing Dow,
Hou-Chien Chang,
Wen-Yu Chiu
Publication year - 2015
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/2.0531510jes
Subject(s) - copper plating , materials science , copper , electroplating , plating (geology) , taguchi methods , orthogonal array , printed circuit board , electrode , composite material , metallurgy , linear sweep voltammetry , cyclic voltammetry , electronic engineering , electrochemistry , chemistry , engineering , electrical engineering , layer (electronics) , geophysics , geology
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