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The Modular Power SIP An Innovative Packaging Technique for Smartpower Integrated Circuits
Author(s) -
Phil Davies
Publication year - 1987
Publication title -
ecs proceedings volumes
Language(s) - English
Resource type - Journals
eISSN - 2576-1579
pISSN - 0161-6374
DOI - 10.1149/198713.0218pv
Subject(s) - modular design , system in package , power (physics) , integrated circuit , power integrity , electrical engineering , packaging engineering , computer science , engineering , electronic engineering , mechanical engineering , printed circuit board , operating system , signal integrity , chip , physics , quantum mechanics

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