Open AccessInfluences of Impurity Incorporation in Electroplated Cu on the SnAgCu and Ni-Containing SnAgCu Solder Joints
Author(s) -
Po-Kai Chen,
Yu-Ju Li,
YeeWen Yen,
ChihMing Chen
Publication year - 2022
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1945-7111/ac7105
Subject(s) - impurity , kirkendall effect , soldering , materials science , metallurgy , void (composites) , electroplating , composite material , chemistry , layer (electronics) , organic chemistry
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom