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Quantification of the Nano-Voids in Electroless Deposited Copper Layers Using SiNx TEM Grids
Author(s) -
So-Yoon Park,
HyunWoo Cha,
Jaewoo Joung,
CheolWoong Yang
Publication year - 2021
Publication title -
journal of the electrochemical society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.258
H-Index - 271
eISSN - 1945-7111
pISSN - 0013-4651
DOI - 10.1149/1945-7111/ac2bec
Subject(s) - copper , nano , materials science , nanotechnology , metallurgy , composite material

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