Copper Immersion Deposition on Magnesium Alloy: The Effect of Fluoride and Temperature | Zendy

Lianxi Yang | Zendy; B. Luan | Zendy

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Copper Immersion Deposition on Magnesium Alloy: The Effect of Fluoride and Temperature

Author(s) -

Lianxi Yang,

B. Luan

Publication year - 2005

Publication title -

journal of the electrochemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.258

H-Index - 271

eISSN - 1945-7111

pISSN - 0013-4651

DOI - 10.1149/1.1923728

Subject(s) - copper , immersion (mathematics) , x ray photoelectron spectroscopy , magnesium , magnesium fluoride , hydrofluoric acid , dielectric spectroscopy , chemistry , magnesium alloy , electrochemistry , scanning electron microscope , materials science , corrosion , metallurgy , deposition (geology) , inorganic chemistry , alloy , chemical engineering , composite material , electrode , paleontology , mathematics , sediment , pure mathematics , engineering , biology

A study was carried out to examine copper immersion deposition on AZ91 magnesium alloy in a hydrofluoric acid-containing bath. The role of fluoride and the effect of bath temperature were investigated. The study was performed by measuring the ac impedance and open-circuit potentials in combination with X-ray photoelectron spectroscopy and scanning electron microscopy surface analysis. Results showed that the effect of both HF concentration and temperature on copper immersion deposition is significant, via affecting the surface film formation on the magnesium surface. A model for understanding the copper immersion deposition process is depicted based on surface characterization and the electrochemical measurements.Peer reviewed: YesNRC publication: Ye

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