Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks | Zendy

Sebastian Killge | Zendy; Sujay Charania | Zendy; K. Richter | Zendy; Niels Neumann | Zendy; Zaid Al-Husseini | Zendy; Dirk Plettemeier | Zendy; Johann W. Bartha | Zendy

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Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks

Author(s) -

Sebastian Killge,

Sujay Charania,

K. Richter,

Niels Neumann,

Zaid Al-Husseini,

Dirk Plettemeier,

Johann W. Bartha

Publication year - 2017

Publication title -

proceedings of spie, the international society for optical engineering/proceedings of spie

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.192

H-Index - 176

eISSN - 1996-756X

pISSN - 0277-786X

DOI - 10.1117/12.2265168

Subject(s) - materials science , interposer , optoelectronics , optical interconnect , cladding (metalworking) , waveguide , silicon photonics , multi mode optical fiber , optical link , chip , fabrication , optical switch , photonics , optical fiber , interconnection , computer science , telecommunications , nanotechnology , layer (electronics) , medicine , etching (microfabrication) , alternative medicine , pathology , metallurgy

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