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Assembly of optical transceivers for board-level optical interconnects
Author(s) -
Krzysztof Niewęgłowski,
Karlheinz Bock
Publication year - 2016
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.2227903
Subject(s) - interposer , transceiver , optical link , multi mode optical fiber , optical cross connect , optical switch , optical transistor , materials science , optical performance monitoring , coupling (piping) , planar , optoelectronics , overlay , fiber optic splitter , electronic engineering , computer science , optical coupling , optical fiber , engineering , wavelength division multiplexing , electrical engineering , telecommunications , layer (electronics) , cmos , etching (microfabrication) , wavelength , fiber optic sensor , nanotechnology , computer graphics (images) , transistor , voltage , metallurgy , programming language

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