Two-dimensional low-coherence interferometry for the characterization of nanometer wafer topographies
Author(s) -
Ch. Taudt,
Tobias Baselt,
Bryan Nelsen,
H. Aßmann,
Andreas Greiner,
Edmund Koch,
Péter Hartmann
Publication year - 2016
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.2227887
Subject(s) - interferometry , coherence (philosophical gambling strategy) , nanometre , wafer , optics , characterization (materials science) , materials science , optoelectronics , physics , quantum mechanics
Within this work a scan-free, low-coherence interferometry approach for surface profilometry with nm-precision is presented. The basic setup consist of a Michelson-type interferometer which is powered by a super-continuum light-source (Δλ= 400-1700 nm). The introduction of an element with known dispersion delivers a controlled phase variation which can be detected in the spectral domain and used to reconstruct height differences on a sample. In order to enable scan-free measurements, the interference signal is spectrally decomposed with a grating and imaged onto a two-dimensional detector. One dimension of this detector records spectral, and therefore height information, while the other dimension stores the spatial position of the corresponding height values. In experiments on a height standard, it could be shown that the setup is capable of recording multiple height steps of 101 nm over a range of 500 m with an accuracy of about 11.5 nm. Further experiments on conductive paths of a micro-electro-mechanical systems (MEMS) pressure sensor demonstrated that the approach is also suitable to precisely characterize nanometer-sized structures on production-relevant components. The main advantage of the proposed measurement approach is the possibility to collect precise height information over a line on a surface without the need for scanning. This feature makes it interesting for a production-accompanying metrology
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