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3D-ICs created using oblique processing
Author(s) -
David Bruce Burckel
Publication year - 2016
Publication title -
proceedings of spie, the international society for optical engineering/proceedings of spie
Language(s) - Uncategorized
Resource type - Conference proceedings
SCImago Journal Rank - 0.192
H-Index - 176
eISSN - 1996-756X
pISSN - 0277-786X
DOI - 10.1117/12.2218696
Subject(s) - interconnection , cmos , lithography , wafer , planar , capacitance , integrated circuit , electronic engineering , through silicon via , computer science , materials science , engineering , electrical engineering , optoelectronics , computer network , chemistry , computer graphics (images) , electrode

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