Open AccessPhase, grain structure, stress, and resistivity of sputter-deposited tungsten films
Author(s) -
Dooho Choi,
Bincheng Wang,
Suk Jae Chung,
Xuan Liu,
Amith Darbal,
Adam Wise,
Noel T. Nuhfer,
Katayun Barmak,
Andrew P. Warren,
Kevin R. Coffey,
Michael F. Toney
Publication year - 2011
Publication title -
journal of vacuum science and technology a vacuum surfaces and films
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.583
H-Index - 112
eISSN - 1520-8559
pISSN - 0734-2101
DOI - 10.1116/1.3622619
Subject(s) - materials science , electrical resistivity and conductivity , annealing (glass) , sputtering , tungsten , thin film , crystallite , composite material , grain size , stress relaxation , analytical chemistry (journal) , metallurgy , nanotechnology , chemistry , electrical engineering , creep , chromatography , engineering
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