Open AccessEvolution of Interfacial Microstructure During Resistance Spot Welding of Cu and Al With Ni-P Coating
Author(s) -
Nannan Chen,
Hongliang Wang,
Jingjing Li,
Vic Liu,
James G. Schroth
Publication year - 2021
Publication title -
volume 2: manufacturing processes; manufacturing systems; nano/micro/meso manufacturing; quality and reliability
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1115/msec2021-60759
Subject(s) - materials science , spot welding , intermetallic , kirkendall effect , microstructure , welding , metallurgy , eutectic system , void (composites) , copper , coating , nickel , composite material , brittleness , alloy
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