Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions | Zendy

Gilberto Moreno | Zendy; Sreekant Narumanchi | Zendy; Xuhui Feng | Zendy; Paul Anschel | Zendy; Steve Myers | Zendy; Phil Keller | Zendy

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Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Author(s) -

Gilberto Moreno,

Sreekant Narumanchi,

Xuhui Feng,

Paul Anschel,

Steve Myers,

Phil Keller

Publication year - 2021

Publication title -

journal of electronic packaging

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.523

H-Index - 52

eISSN - 1528-9044

pISSN - 1043-7398

DOI - 10.1115/1.4049815

Subject(s) - junction temperature , thermal resistance , power electronics , electronics , power module , thermal grease , heat sink , mechanical engineering , automotive engineering , automotive industry , power semiconductor device , power density , automotive electronics , capacitor , electrical engineering , reliability (semiconductor) , electronic packaging , thermal , materials science , power (physics) , voltage , engineering , physics , quantum mechanics , aerospace engineering , meteorology

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