Open AccessDemonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Author(s) -
Jin Cui,
Liang Pan,
Justin A. Weibel
Publication year - 2020
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4047356
Subject(s) - materials science , heat sink , thermal resistance , optoelectronics , transceiver , microscale chemistry , thermal , thermal grease , thermal contact conductance , composite material , thermal conductivity , mechanical engineering , engineering , cmos , physics , mathematics education , mathematics , meteorology
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