Open AccessGold-Tin Solder Wetting Behavior for Package Lid Seals
Author(s) -
Paul T. Vianco,
Alice C. Kilgo,
Bonnie M. McKenzie
Publication year - 2018
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4039749
Subject(s) - materials science , soldering , wetting , auger electron spectroscopy , metallurgy , layer (electronics) , contamination , ceramic , tin , reflow soldering , composite material , surface roughness , ecology , physics , nuclear physics , biology
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