Open AccessEFFECT OF ETCHING AS PRE-TREATMENT FOR ELECTROLESS COPPER PLATING ON SILICON WAFER
Author(s) -
Shazatul Akmaliah Mior Shahidin,
Nor Akmal Fadil,
Mohd Zamri Mohd Yusop,
Mohd Nasir Tamin,
Shahrul Azmir Osman
Publication year - 2017
Publication title -
jurnal teknologi/jurnal teknologi
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.191
H-Index - 22
eISSN - 2180-3722
pISSN - 0127-9696
DOI - 10.11113/jt.v79.10640
Subject(s) - etching (microfabrication) , wafer , materials science , hydrofluoric acid , copper , substrate (aquarium) , layer (electronics) , silicon , plating (geology) , dry etching , copper plating , metallurgy , isotropic etching , coating , scanning electron microscope , adhesion , composite material , nanotechnology , electroplating , oceanography , geophysics , geology