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Investigation of cutting methods for small samples of Hayabusa and future sample return missions
Author(s) -
Uesugi Masayuki,
Noguchi Ryo,
Matsumoto Tooru,
Matsuno Junya,
Nagano Takashi,
Tsuchiyama Akira,
Harada Shigenori,
Yokoyama Kaori,
Yodo Yoshiaki,
Takeda Noboru,
Yada Toru,
Yakame Shogo,
Karouji Yuzuru,
Ishibashi Yukihiro,
Abe Masanao,
Okada Tatsuaki,
Fujimura Akio,
Ebihara Mitsuru,
Kitajima Fumio,
Nagao Keisuke,
Nakamura Tomoki,
Naraoka Hiroshi,
Noguchi Takaaki,
Okazaki Ryuji,
Yurimoto Hisayoshi
Publication year - 2014
Publication title -
meteoritics and planetary science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.09
H-Index - 100
eISSN - 1945-5100
pISSN - 1086-9379
DOI - 10.1111/maps.12322
Subject(s) - wafer dicing , sample (material) , contamination , laser cutting , materials science , blade (archaeology) , optics , analytical chemistry (journal) , laser , nanotechnology , mechanical engineering , chemistry , engineering , physics , environmental chemistry , chromatography , ecology , wafer , biology
Abstract We report the investigation of cutting methods for Hayabusa samples. The purpose of our study is to explore the possibility of applying multiple analyses to a single particle effectively. We investigated the cutting performance of a blade dicing saw, laser, focused ion beam ( FIB ), and physical breaking by microindenter. Cutting performance was examined by estimating the aspect ratio of the cut slit, i.e., depth over width of the slit. We also investigated the possible contamination and sample damage by cutting. The result of the investigation shows that we can cut the samples from <50 μm to 500 μm using those methods with aspect ratios from 10 to 20, although they would introduce some contamination or damage to the samples. Our investigations also provide an important basis for the analysis of samples obtained by future sample return missions.