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Numerical simulation of heat conduction in a random ballistic deposited grain aggregate
Author(s) -
Sirono Siniti
Publication year - 2014
Publication title -
meteoritics and planetary science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.09
H-Index - 100
eISSN - 1945-5100
pISSN - 1086-9379
DOI - 10.1111/maps.12245
Subject(s) - thermal conduction , anisotropy , materials science , deposition (geology) , exponential function , thermal conductivity , grain size , atomic packing factor , perpendicular , porosity , composite material , aggregate (composite) , condensed matter physics , geometry , chemistry , physics , mathematics , geology , crystallography , optics , mathematical analysis , paleontology , sediment
A numerical simulation of heat conduction in a grain aggregate is carried out to determine the packing fraction (the spatial fraction occupied by grains or 1‐porosity) dependence of the thermal conductivity of the aggregate. Arrangements of grains are given by random ballistic deposition. It is found that the packing fraction dependence is well approximated by an exponential function. The number of contacts between grains is the crucial quantity in the conduction, and its packing fraction dependence is exponential. Heat conduction is found to be anisotropic, where the conduction along the deposition direction is more efficient than that perpendicular to the deposition direction.