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Novel techniques of preparing TEM samples for characterization of irradiation damage
Author(s) -
ZHANG H. K.,
LONG F.,
YAO Z.,
DAYMOND M.R.
Publication year - 2013
Publication title -
journal of microscopy
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.569
H-Index - 111
eISSN - 1365-2818
pISSN - 0022-2720
DOI - 10.1111/jmi.12085
Subject(s) - electropolishing , polishing , materials science , foil method , electroplating , transmission electron microscopy , sample preparation , focused ion beam , irradiation , sputtering , ion beam , layer (electronics) , ion , composite material , nanotechnology , chemistry , electrode , thin film , chromatography , electrolyte , physics , organic chemistry , nuclear physics
Summary Focus ion beam preparation of transmission electron microscopy (TEM) samples has become increasingly popular due to the relative ease of extraction of TEM foils from specific locations within a larger sample. However the sputtering damage induced by Ga ion bombardment in focus ion beam means that traditional electropolishing may be a preferable method. First, we describe a special electropolishing method for the preparation of irregular TEM samples from ex‐service nuclear reactor components, spring‐shaped spacers. This method has also been used to prepare samples from a nonirradiated component for a TEM in situ heavy ion irradiation study. Because the specimen size is small (0.7 × 0.7 × 3 mm), a sandwich installation is adopted to obtain high quality polishing. Second, we describe some modifications to a conventional TEM cross‐section sample preparation method that employs Ni electroplating. There are limitations to this method when preparing cross‐section samples from either (1) metals which are difficult to activate for electroplating, or (2) a heavy ion irradiated foil with a very shallow damage layer close to the surface, which may be affected by the electroplating process. As a consequence, a novel technique for preparing cross‐section samples was developed and is described.