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Electrostatic Spraying of Potassium Sorbate for the Reduction of Yeast and Molds on Cakes
Author(s) -
Kerr William L.,
Kerr Clark A.
Publication year - 2015
Publication title -
journal of food processing and preservation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.511
H-Index - 48
eISSN - 1745-4549
pISSN - 0145-8892
DOI - 10.1111/jfpp.12461
Subject(s) - potassium sorbate , chemistry , food science , shelf life , mold , potassium , yeast , fungal growth , composite material , materials science , microbiology and biotechnology , biochemistry , organic chemistry , biology , sugar
Electrostatic spraying ( ES ) was tested as a means of improving shelf life of cupcakes. A 5% potassium sorbate solution was sprayed, with and without electrostatic charging, onto yellow cupcakes for 1–3 s. Image analyses showed that electrostatic charging increased the uniformity of coverage, with 62–78% area coverage with charging and 36–41% without. Samples were also held at 25C and either 75 or 85% relative humidity ( RH ). At 75% RH , visible mold appeared after 10 days for control and after 11 days for cakes sprayed with sorbate. At 85% RH , fungal growth appeared after 3 days for control, 4 days for cakes with sorbate spray and 5 days for those with ES sorbate. In all cases, ES delayed the onset of mold and subsequent growth as compared with uncharged sprays. ES also provided a small decrease in the rate of firmness development during storage. Practical Applications Substantial quantities of breads, cakes and other baked goods suffer a loss of quality or must be discarded because of contamination by yeast and molds. While some ingredient and processing technologies exist to extend the shelf life of baked goods, there is much room for improvement. This research examines the use of electrostatic charging to improve adhesion and coverage of antimicrobial sprays. The results indicate that electrostatic charging of potassium sorbate solutions improves overall surface coverage, slows the onset of microbial growth and limits subsequent growth compared with conventionally applied sprays.