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Tunable chromaticity and high color rendering index of WLEDs with CaAlSiN 3 :Eu 2+ and YAG:Ce 3+ dual phosphor‐in‐silica‐glass
Author(s) -
Huang Ping,
Zhao Yuye,
Wang Jiancheng,
Zheng Yaru,
Yang Peng,
Zheng Qi,
Gu Shijia,
Zhou Beiying,
Jiang Wan,
Wang Lianjun
Publication year - 2020
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.17210
Subject(s) - phosphor , chromaticity , materials science , color rendering index , color temperature , luminescence , thermal stability , sintering , optoelectronics , light emitting diode , analytical chemistry (journal) , optics , composite material , chemical engineering , chemistry , physics , chromatography , engineering
Phosphors‐in‐glass (PiG), which serves as a potential bi‐replacement of both phosphors and organic encapsulants in high‐power white light‐emitting diodes (WLEDs), has captured much attention due to its high thermal stability and excellent luminescent properties. However, due to the high‐temperature sensitivity and the chemical reactions between phosphors with glass matrix, a variety of phosphors, especially red phosphors could be hardly dispersed into the glass without thermal quenching and decomposition, which greatly limits the improvement of color rendering index and chromaticity tunability of the WLEDs. In this study, adopting the mesoporous silica (FDU‐12) and commercial phosphors as raw materials, the phosphors‐in‐silica‐glasses (PiSGs) embedded with red phosphor CaAlSiN 3 :Eu 2+ and yellow phosphor YAG:Ce 3+ have been successfully prepared at low sintering temperature (950°C) and short preparation time (10 minutes) using spark plasma sintering. Owing to the well preservation of the originally emissive properties of the embedded phosphors, the warm WLEDs with tunable chromaticity and exhibited a superior performance with LE of 133 lm/W, CCT of 3970 K and CRI of 81 were fabricated by encapsulating the as‐prepared PiSGs on the blue chips. Moreover, the PiSG composite exhibits a high thermal conductivity up to 1.6 W/m·K.