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Revealing the effects of aerosol deposition on the substrate‐film interface using NaCl coating
Author(s) -
Khansur Neamul H.,
Eckstein Udo,
Li Yizhe,
Hall David A.,
Kaschta Joachim,
Webber Kyle G.
Publication year - 2019
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.16489
Subject(s) - materials science , ceramic , composite material , coating , deposition (geology) , substrate (aquarium) , aerosol , residual stress , layer (electronics) , surface energy , nanoparticle , chemical engineering , nanotechnology , chemistry , paleontology , oceanography , organic chemistry , sediment , engineering , geology , biology
Aerosol deposition is a feasible method of fabricating dense ceramic films at room temperature by the impact consolidation of submicron‐sized particles on ceramic, metal, glass, and polymer substrates at a rapid rate. Despite the potential usefulness of the aerosol deposition process, there are issues, such as deposition mechanisms and structure of the film‐substrate interface, that are not well understood. We have used complementary structural and microstructural analysis to capture the state of the substrate surface after the aerosol deposition process. The results reveal that modification of the substrate surface by the ejected submicron‐sized particles is essential for the formation of anchoring layer, thereby, a change in internal residual stress state and surface free energy of the substrate is required to deposit film using AD process. Our analysis also suggests that the adhesion between the metal substrate and ceramic particles is possibly contributed by both physical bonding and mechanical interlocking.