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Low‐temperature ultrasound‐activated joining of ZrO 2 ceramics using Sn–Al–Cu solder
Author(s) -
Dong Hongjie,
Li Zhuolin,
Song Xiaoguo,
Guo Xiajun,
Luo Yanxu,
Bai Tiansheng,
Wei Shoujing,
Zhao Hongyun,
Yan Jiuchun,
Feng Jicai
Publication year - 2019
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.16293
Subject(s) - materials science , soldering , ceramic , acoustic streaming , cavitation , ultrasonic sensor , ultimate tensile strength , metallurgy , composite material , layer (electronics) , aluminium , amorphous solid , ultrasound , crystallography , chemistry , physics , acoustics , mechanics
In this study, the low‐temperature ultrasound‐activated joining of ZrO 2 ceramics using Sn–4Al–0.7Cu solder was achieved at 350°C. It was found that a nanoscale amorphous Al 2 O 3 layer formed at the solder‐ceramic interface during the ultrasonic soldering process. The occurrence of the interfacial oxidation of aluminum could be attributed to the sonochemical effects of acoustic cavitation and turbulent streaming induced by the propagation of ultrasonic waves in the liquid solder. The formed butt joints exhibited an average tensile strength of 47.3 MPa.