z-logo
Premium
Synthesis and properties of conductive B 4 C ceramic composites with TiB 2 grain network
Author(s) -
Ren Donglou,
Deng Qihuang,
Wang Ji,
Yang Jisen,
Li Youbing,
Shao Junqi,
Li Mian,
Zhou Jie,
Ran Songlin,
Du Shiyu,
Huang Qing
Publication year - 2018
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.15541
Subject(s) - materials science , composite material , ceramic , sintering , fracture toughness , composite number , grain boundary , electrical resistivity and conductivity , ball mill , electrical conductor , microstructure , electrical engineering , engineering
High electrical resistance and low fracture toughness of B 4 C ceramics are 2 of the primary challenges for further machining of B 4 C ceramics. This report illustrates that these 2 challenges can be overcome simultaneously using core‐shell B 4 C‐TiB 2 &TiC powder composites, which were prepared by molten‐salt method using B 4 C (10 ± 0.6 μm) and Ti powders as raw materials without co‐ball milling. Finally, the near completely dense (98%) B 4 C‐TiB 2 interlayer ceramic composites were successfully fabricated by subsequent pulsed electric current sintering ( PECS ). The uniform conductive coating on the surface of B 4 C particles improved the mass transport by electro‐migration in PECS and thus enhanced the sinterability of the composites at a comparatively low temperature of 1700°C. The mechanical, electrical and thermal properties of the ceramic composites were investigated. The interconnected conductive TiB 2 phase at the grain boundary of B 4 C significantly improved the properties of B 4 C‐TiB 2 ceramic composites: in the case of B 4 C‐29.8 vol% TiB 2 composite, the fracture toughness of 4.38 MPa·m 1/2 , the electrical conductivity of 4.06 × 10 5  S/m, and a high thermal conductivity of 33 W/mK were achieved.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom