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A simple method of short‐term mechanical reliability prediction for ceramics in reactive environments
Author(s) -
Cook Robert F.
Publication year - 2018
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.15526
Subject(s) - reliability (semiconductor) , ceramic , materials science , indentation , simplicity , term (time) , constraint (computer aided design) , simple (philosophy) , fracture (geology) , reliability engineering , composite material , structural engineering , power (physics) , mechanical engineering , engineering , thermodynamics , physics , philosophy , epistemology , quantum mechanics
A method is demonstrated for prediction of ceramic reliability limited by fracture in reactive environments. The simplicity of the method relies on the ceramic displaying ideal indentation‐strength behavior and on the applied loading leading to short‐term power‐law crack velocity behavior. Reactive failure strength measurements, treating flaw size as a variable and failure time as a constraint in a “pass‐fail” test, enable reliability, including both intrinsic and contact flaws, to be predicted. Little to no computation is required.