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Thermal Runaway in Mold‐Assisted Flash Sintering
Author(s) -
Dong Yanhao,
Chen I.Wei
Publication year - 2016
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.14413
Subject(s) - flash (photography) , mold , thermal runaway , joule heating , materials science , sintering , thermal conduction , thermal , composite material , nuclear engineering , power (physics) , optics , thermodynamics , physics , battery (electricity) , engineering
Analyzing the temperature evolution in pressureless mold‐assisted flash sintering, we found the same onset condition as in standard flash sintering: When sample's DC or AC Joule heating replaces environment's radiation heating as the dominant power input term, thermal runaway ensues. Various serial and parallel components connected to the sample, including the mold, insulation, and punches, can affect Joule heating and conduction heat loss, thus play an important role in successful mold‐assisted flash sintering.