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Mechanical Behavior and Electromagnetic Interference Shielding Properties of C/SiC–Ti 3 Si(Al)C 2
Author(s) -
Fan Xiaomeng,
Yin Xiaowei,
Chen Lingqi,
Zhang Litong,
Cheng Laifei
Publication year - 2016
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.14124
Subject(s) - materials science , microstructure , composite material , electromagnetic shielding , alloy , volume fraction , electrical resistivity and conductivity , electromagnetic interference , emi , electronic engineering , electrical engineering , engineering
In this paper, a low‐temperature densification process of Al–Si alloy infiltration was developed to fabricate C/SiC–Ti 3 Si(Al)C 2 , and then the microstructure, mechanical, and electromagnetic interference ( EMI ) shielding properties were studied compared with those of C/SiC–Ti 3 SiC 2 and C/SiC–Si. The interbundle matrix of C/SiC–Ti 3 Si(Al)C 2 is mainly composed of Ti 3 Si(Al)C 2 , which can bring various microdeformation mechanisms, high damage tolerance, and electrical conductivity, leading to the high effective volume fraction of loading fibers and electrical conductivity of C/SiC–Ti 3 Si(Al)C 2 . Therefore, C/SiC–Ti 3 Si(Al)C 2 shows excellent bending strength of 556 MPa, fracture toughness 21.6 MPa·m 1/2 , and EMI shielding effectiveness of 43.9 dB over the frequency of 8.2–12.4 GHz. Compared with C/SiC–Si and C/SiC–Ti 3 SiC 2 , both the improvement of mechanical properties and EMI shielding effectiveness can be obtained by the introduction of Ti 3 Si(Al)C 2 into C/SiC, revealing great potential as structural and functional materials.