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Comparison of Consolidation Routes for Mo–Si–B Materials Prepared by Using Nitride Containing Powders
Author(s) -
Wiltner Almut,
Klöden Burghardt,
Hilger Isabell,
Weißgärber Thomas,
Kieback Bernd
Publication year - 2015
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.13764
Subject(s) - materials science , intermetallic , microstructure , sintering , metallurgy , spark plasma sintering , hot pressing , ternary operation , melting point , composite material , alloy , computer science , programming language
Pressureless sintering is a well‐established powder metallurgical route for processing and consolidation of mixed materials. Especially materials exhibiting a high melting point could be densified without tool abrasion by this sintering technique. As the sintering temperatures are often higher compared to pressure‐assisted techniques care must be taken by means of grain growth. In our studies we used a ternary compound mixture to obtain Mo‐based alloys. Consolidation applying pressure‐assisted methods (hot pressing, spark plasma sintering) and pressureless sintering were used, respectively. The densities reached and the microstructures obtained were compared. These Mo–Si–B alloys were processed using a nitride‐powder‐based route offering lower impurity contents due to short processing times by avoiding time consuming mixing / milling steps. The sintering conditions depending on the powder particle size as well as the sample shape will be presented in detail. The composition investigated in this article offered a continuous α‐Mo matrix with intermetallic islands consisting of Mo 3 Si and Mo 5 SiB 2 (T2) phases. The combination of a ductile α‐Mo matrix and intermetallic phases embedded within offered an enhanced mechanical behavior at room temperature compared to MoSi 2 or other intermetallic alloys. Moreover, the intermetallic compounds as well as Mo are candidates for high‐temperature applications. As the high‐temperature behavior could be strongly influenced by the respective microstructure we present here the processing and the microstructure obtained.

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