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Oxidation Behavior of SiC Whiskers at 600–1400°C in Air
Author(s) -
Kuang Jianlei,
Cao Wenbin
Publication year - 2014
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.13096
Subject(s) - whiskers , materials science , isothermal process , whisker , diffusion , kinetics , oxygen , chemical engineering , activation energy , layer (electronics) , composite material , chemistry , thermodynamics , physics , organic chemistry , quantum mechanics , engineering
The oxidation behavior of SiC whiskers ( SiC W ) with a diameter size of 50–200 nm has been investigated at 600°C–1400°C in air. Experimental results reveal that SiC W exhibit a low oxidation rate below 1100°C while a significant larger oxidation rate after that. This can be attributed to the small diameter size of SiC W , which determines that it is hard to form a protective SiO 2 layer thick enough to hamper the diffusion of oxygen effectively. Both nonisothermal and isothermal oxidation kinetics were studied and the apparent oxidation energy was calculated to further understand the oxidation behavior of the SiC W .