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Improvement of Thermoelectric Properties of In 4 Se 3 Bulk Materials with Cu Nanoinclusions
Author(s) -
Li Gen,
Yang Junyou,
Luo Yubo,
Xiao Ye,
Fu Liangwei,
Liu Ming,
Peng Jiangying
Publication year - 2013
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.12518
Subject(s) - thermoelectric effect , microstructure , materials science , matrix (chemical analysis) , nanoparticle , thermal decomposition , seebeck coefficient , nanocomposite , thermal conductivity , chemical engineering , composite material , nanotechnology , chemistry , physics , thermodynamics , organic chemistry , engineering
In 4 Se 3 bulk materials with Cu nanoinclusions, which were introduced by thermal decomposition of Cu ( OA c) 2 , were prepared by mechanical alloying and subsequent hot‐press process. Effect of Cu nanoparticles content on the microstructure and thermoelectric properties of the composites were investigated in detail. It shows that Cu particles are about 30 nm in size and distribute homogeneously in the In 4 Se 3 matrix when the content of Cu ( OA c) 2 is not more than 0.3 wt%. The thermal conductivities of the composites were greatly reduced due to the enhanced phonon scattering by nanoinclusions, and their power factors were also enhanced with addition of Cu nanoinclusions. A maximum ZT of 0.97 at 723 K was obtained when the addition content of Cu ( OA c) 2 was 0.3 wt%