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Diffusion and Stress Coupling Effect during Oxidation at High Temperature
Author(s) -
Dong Xuelin,
Fang Xufei,
Feng Xue,
Hwang KehChih
Publication year - 2013
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.12105
Subject(s) - diffusion , stress (linguistics) , coupling (piping) , materials science , kinetics , effective diffusion coefficient , thermodynamics , metallurgy , physics , medicine , linguistics , philosophy , radiology , quantum mechanics , magnetic resonance imaging
We report the diffusion and stress coupling effect during oxidation. An analytical model is developed for the stress and diffusion coupling effect based on equilibrium relationship and diffusion equation considering for the stress effect. Compressive stress will generate during the oxidation due to the growth strain. This growth stress can modify the diffusion coefficient; therefore, the oxidation kinetics is also affected. The coupling effect reduces both the oxidation rate and the stress. The proposed model is applied to predict the oxidation evolution for SiC and its consistence with the experimental data demonstrates the theoretical analysis.