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Preparation of Nickel Ferrite–Copper Composite by Pressureless Infiltration
Author(s) -
Tao Yuqiang,
Li Zhiyou,
Zhang Lei,
Gan Xueping,
Zhou Kechao
Publication year - 2012
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.12080
Subject(s) - materials science , composite number , wetting , microstructure , copper , flexural strength , thermal diffusivity , composite material , nickel , infiltration (hvac) , ferrite (magnet) , metal , thermal conductivity , metallurgy , physics , quantum mechanics
Pressureless infiltration was used to prepare a dense Cu / NiFe 2 O 4 –10 NiO composite with interlocking microstructure. The results showed that the addition of Cu 2 O in Cu could improve the wettability between Cu and NiFe 2 O 4 . The metallic phase content and densification of the resulting composite were 34 wt% and 99.2%, respectively. The resulting composite had a flexural strength of 200 ± 20 MPa, a room‐temperature thermal diffusivity of 0.12 cm 2 /s, and an electrical conductivity of 1503 S/cm at 900°C.