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The gold solder, gold alloy interface
Author(s) -
Rogers Olbert W.
Publication year - 1977
Publication title -
australian dental journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.701
H-Index - 71
eISSN - 1834-7819
pISSN - 0045-0421
DOI - 10.1111/j.1834-7819.1977.tb04483.x
Subject(s) - gold alloy , soldering , materials science , metallurgy , gold alloys , alloy , penetration (warfare) , quenching (fluorescence) , metal , physics , operations research , quantum mechanics , engineering , fluorescence
A bstract — With soldering the physical properties of the basis metal must be maintained and a minimum of molten metal is used. An examination of joints in 17 gauge platinized gold wire is made with 18 k gold solder following quenching immediately after flow and cooling in air; there is a widening of grain boundaries and intergranulation penetration in the latter method. A comparison with the cast gold joint is made. Some inclusions were noted.