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COMPUTER SIMULATION of CAPACITIVE RADIO FREQUENCY (RF) DIELECTRIC HEATING ON VEGETABLE SPROUT SEEDS
Author(s) -
YANG JUN,
ZHAO YANYUN,
WELLS JOHN HENRY
Publication year - 2003
Publication title -
journal of food process engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.507
H-Index - 45
eISSN - 1745-4530
pISSN - 0145-8876
DOI - 10.1111/j.1745-4530.2003.tb00600.x
Subject(s) - dielectric , rectangle , capacitive sensing , radio frequency , materials science , dielectric heating , moisture , thermal , finite element method , enhanced data rates for gsm evolution , composite material , electrical engineering , mathematics , physics , engineering , thermodynamics , geometry , optoelectronics , telecommunications
The application of a three‐dimensional finite‐element computer program package, TLM‐FOOD‐HEATING (FAUSTUS Scientific Corp., Victoria, Canada), on the simulation of capacitive radio frequency (RF) dielectric heating of radish and alfalfa seeds was investigated. Seeds placed inside polystyrene boxes were described as a rectangle, where nonuniform boundary conditions presented complications in the simulation. Temperature and moisture dependent thermal properties and temperature and frequency dependent dielectric properties of seeds were considered in the modeling. the time‐temperature profiles of seeds at different locations within the rectangle seeds boxes were simulated. the model was then validated using experimental data. Simulated temperature distribution in seeds was consistent with the measured results. the absolute temperature differences between simulated and measured values in radish seeds packed in a 100 × 25 × 50 mm rectangle seeds box were 1.8C, 1.1C, 8.9C, and 13.6C in the center, top, edge, and bottom locations, respectively, when seeds reached about 80C, and were 0.9C, 2.4C, 7.75C, and 14.3C, respectively, in alfalfa seeds box in the same conditions.