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RHEOLOGICAL MODEL OF SOY DOUGH IN EXTRUSION
Author(s) -
CHEN A. H.,
JAO Y. C.,
LARKIN J. W.,
GOLDSTEIN W. E.
Publication year - 1978
Publication title -
journal of food process engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.507
H-Index - 45
eISSN - 1745-4530
pISSN - 0145-8876
DOI - 10.1111/j.1745-4530.1978.tb00215.x
Subject(s) - extrusion , rheology , shear rate , viscosity , moisture , apparent viscosity , shear (geology) , materials science , food science , chemistry , composite material
A viscosity model of defatted soy dough under various conditions of shear rate, temperature and moisture level in the extrusion process is reported. The model represents the data well within the shear rate range of 50 to 1,000 s −1 , the temperature range of 100 °C to 160 °C, and the added moisture range of 22% to 32%. The flow index is determined to be 0.127, and response surfaces of the viscosity are also presented.