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Al 2 O 3 – Al 2 O 3 and Al 2 O 3 – Ti Solder Joints—Influence of Ceramic Metallization and Thermal Pretreatment on Joint Properties
Author(s) -
Leinenbach Christian,
Weyrich Nico,
Elsener HansRudolf,
Gamez Gerardo
Publication year - 2012
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2012.02769.x
Subject(s) - materials science
In this work, Al 2 O 3 – Al 2 O 3 and Al 2 O 3 – Ti solder joints intended for space applications were realized by applying metallic multilayers both on Ti and on polycrystalline Al 2 O 3 substrates to ensure wetting during the soldering process. The eutectic Au‐12Ge (wt%) alloy with a melting point of 361°C was used as solder material and two different multilayer systems on the ceramic ( Cr‐Ni / Ti‐W / Au , Ti / Pt / Au ) were investigated. The influence of different thermal pretreatments of the Al 2 O 3 plates on the multilayer properties, the interface reactions during soldering and the mechanical properties were studied using Glow‐Discharge Optical Emission Spectroscopy ( GDOES ), X‐ray Photoelectron Spectroscopy ( XPS ), Scanning Electron Microscopy ( SEM ) and a shear test device. It is shown that joints with a good quality can be produced at a soldering temperature of 400°C, whereas their properties and fracture behavior are strongly dependent on the metallization layer properties and the thermal pretreatments.