Premium
Joining of AlN to Ceramic Bonded Carbon for Heat Dissipating Substrates
Author(s) -
Chen Weiwu,
Tojo Tetsuro,
Miyamoto Yoshinari
Publication year - 2012
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2011.02729.x
Subject(s) - materials science , ceramic , composite material , flexural strength , carbon fibers , thermal conductivity , sintering , layer (electronics) , thermal expansion , composite number , hot pressing , bending
Ceramic bonded carbon ( CBC ) is a new composite consisting of carbon particles bonded with thin ceramic boundaries. It can not only reinforce carbon but also provide joining capability with other materials. To obtain light‐weight heat dissipating substrates with matched low coefficients of thermal expansion, a top layer of AlN and a bottom layer of AlN / CBC (20 vol% AlN ) were sintered and joined in one step by hot‐pressing at 1950°C. Both AlN and AlN / CBC were densified and bonded tightly. AlN / CBC has a density of 2.30 g/cm 3 , bending strength of 112 MPa, and thermal conductivity of 170 W/mK. The obtained AlN–AlN / CBC plates showed a high strength as a result of the direct AlN–AlN sintering at the AlN and AlN / CBC interface.