Microstructure Contact Studies for Skutterudite Thermoelectric Devices | Zendy

Zhao Degang | Zendy; Geng Haoran | Zendy; Chen Lidong | Zendy

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Microstructure Contact Studies for Skutterudite Thermoelectric Devices

Author(s) -

Zhao Degang,

Geng Haoran,

Chen Lidong

Publication year - 2012

Publication title -

international journal of applied ceramic technology

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.4

H-Index - 57

eISSN - 1744-7402

pISSN - 1546-542X

DOI - 10.1111/j.1744-7402.2011.02703.x

Subject(s) - skutterudite , materials science , microstructure , spark plasma sintering , thermoelectric effect , contact resistance , foil method , composite material , intermetallic , thermoelectric materials , thermal conductivity , electrode , thermal diffusivity , metallurgy , layer (electronics) , physics , chemistry , alloy , quantum mechanics , thermodynamics

The skutterudite/electrode thermoelectric joints were fabricated with the insertion of Ti foil by spark plasma sintering. The interfacial microstructure and reliability of joints were studied during thermal duration test. A multilayer structure, which was composed of intermetallic compounds, was observed at the CoSb 3 / Ti interface after thermal aging of 20 days. The interfacial reactions and diffusion path between CoSb 3 and Ti were discussed. The contact resistance of CoSb 3 /electrode junction was measured through four‐probe method and the thermal contact resistance was calculated based on multilayer mode measurement. Effects of the contact resistivity on the performance of CoSb 3 ‐based device were discussed.

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