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Microstructure Contact Studies for Skutterudite Thermoelectric Devices
Author(s) -
Zhao Degang,
Geng Haoran,
Chen Lidong
Publication year - 2012
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2011.02703.x
Subject(s) - skutterudite , materials science , microstructure , spark plasma sintering , thermoelectric effect , contact resistance , foil method , composite material , intermetallic , thermoelectric materials , thermal conductivity , electrode , thermal diffusivity , metallurgy , layer (electronics) , physics , chemistry , alloy , quantum mechanics , thermodynamics
The skutterudite/electrode thermoelectric joints were fabricated with the insertion of Ti foil by spark plasma sintering. The interfacial microstructure and reliability of joints were studied during thermal duration test. A multilayer structure, which was composed of intermetallic compounds, was observed at the CoSb 3 / Ti interface after thermal aging of 20 days. The interfacial reactions and diffusion path between CoSb 3 and Ti were discussed. The contact resistance of CoSb 3 /electrode junction was measured through four‐probe method and the thermal contact resistance was calculated based on multilayer mode measurement. Effects of the contact resistivity on the performance of CoSb 3 ‐based device were discussed.