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Electrical Resistance as a Nondestructive Evaluation Technique for SiC/SiC Ceramic Matrix Composites Under Creep‐Rupture Loading
Author(s) -
Smith Craig E.,
Morscher Gregory N.,
Xia Zhenhai
Publication year - 2011
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/j.1744-7402.2010.02587.x
Subject(s) - materials science , composite material , creep , ceramic matrix composite , ceramic , matrix (chemical analysis) , stress (linguistics) , electrical resistance and conductance , philosophy , linguistics
SiC/SiC ceramic matrix composites under creep‐rupture loading accumulate damage by means of local matrix cracks that typically form near a stress concentration, such as a 90° fiber tow or a large matrix pore, and grow over time. Such damage is difficult to detect through conventional techniques. This study demonstrates that electrical resistance is a viable method of monitoring and inspecting damage in SiC/SiC composites at high temperature. Both interrupted and uninterrupted creep‐rupture experiments were performed at 1315°C and 110 MPa with in situ resistance measurements. A linear relationship was found between resistance and cumulative crack depth.